Good quality M Series Connectors - Round Hole IC socket Connector DIP 6 8 14 16 18 20 24 28 40 pin Sockets DIP6 DIP8 DIP14 DIP16 DIP18 DIP20 DIP28 DIP40 pins – Weiting

Electrical

Electrical performance

Contact Resistance: 30mΩmax.DC100mA

Contact resistance: 30mΩ max.DC100mA

Insulator Resistance: 1000MΩmin.atDC500v

Insulation resistance: 1000MΩmin.atDC500v

Withstanding voltage: AC500V/1Min

Withstand voltage: AC500V/1Min

Current Rating: 1AMP

Rated current: 1AMP

Material

Material and plating

Housing: PBT&20%Glass Fiber

Plastic parts: PBT&20%Glass Fiber

Contact: Phosphor bronze

Contact material: phosphor bronze

IC Sockets in Applications

In notebook and desktop computers, our LGA sockets feature a robust bolster plate for reliable connection to the microprocessor package while limiting PCB bowing during compression. In servers, our mPGA and PGA sockets — with custom arrays available in more than 1,000 positions — offer zero insertion force interface to the microprocessor PGA package and attach to the PCB with surface-mount technology soldering. TE’s IC sockets are designed for higher performance CPU processors.

Integrated Circuit Sockets

In notebook and desktop computers, our LGA sockets feature a robust bolster plate for reliable connection to the microprocessor package while limiting PCB bowing during compression. In servers, our mPGA and PGA sockets — with custom arrays available in more than 1,000 positions –offer zero insertion force (ZIF) interface to the microprocessor PGA package and attach to the PCB with surface-mount technology (SMT) soldering. TE’s IC sockets are designed for higher performance CPU processors.

These connectors are designed to provide a compressive interconnect between component leads and a printed circuit board (PCB). Our integrated circuit (IC) sockets are designed to provide a compressive interconnect between component leads and a PCB. Our IC sockets are engineered to help simplify the board design, enabling simple reprogramming and expansion and easy repair and replacement. The design offers a cost-effective solution without the risk of direct soldering.